ChipMOS tests CB appetite

Taiwanese IC test and assembly company boosts disappointing IPO proceeds with a convertible bond.

Jackie Horne

October 28, 2004

Nasdaq-listed ChipMOS Technologies entered the convertible bond market after New York's close on Wednesday with an increased $75 million deal led by Lehman Brothers. The company timed the deal to try and gain a pricing advantage ahead of a pack of prospective Taiwan tech deals from among others: Hannstar, CMC Technologies, QDI and Nan Ya.

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