Stats ChipPAC back in bonds

Singaporean test and assembly company takes advantage of strengthening credit markets.

Jackie Horne

July 13, 2005

Stats ChipPAC returned to the international bond markets for the second time in under a year on July 12 with a $150 million 144a deal via Credit Suisse First Boston. The Ba2/BB rated credit's five-year bullet offering received an extremely strong market response in contrast to the most recent Asian high yield tech deal from the region by Hynix Semiconductor.

Sign In to Your Account To Access Exclusive FinanceAsia Content!

Please sign in to your subscription to unlock full access to our premium FA resources.

Free Registration & 7-Day Trial
Register now to enjoy a 7-day free trial - no registration fees required. Click the link to get started.

Note: This free trial is a one-time offer.

Questions?
If you have any enquiries or would like a quote for a team or company licence, please contact us at [email protected]. Our subscription team will be happy to assist you.